Senior Product Lead (Advanced Semiconductor Packaging & ASIC Design) Job at Tekaccel Inc, California

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  • Tekaccel Inc
  • California

Job Description

Job Title: Senior Product Lead Advanced Semiconductor Packaging & ASIC Design

Location: Santa Clara, CA | 10+ Years Experience

Key Competencies:
  • Semiconductor Industry
  • Advanced Packaging & ASIC Design
  • Mixed-Signal & Chiplet Design
  • BEOL & FEOL Semiconductor Processing
  • Signal & Power Integrity
About the Role:

We are seeking a Senior Product Lead to drive cutting-edge advancements in semiconductor electronics and AI . This role focuses on advanced packaging, chiplet integration, and ASIC design , ensuring seamless signal and power integrity while leveraging the latest semiconductor processing technologies.

Key Responsibilities:
  • Lead the product development lifecycle for advanced semiconductor electronics and ASICs .
  • Collaborate with cross-functional teams to develop mixed-signal and chiplet designs .
  • Drive chiplet integration and optimize high-speed chiplet I/O .
  • Ensure signal and power integrity across all design and implementation phases.
  • Stay updated with emerging trends in advanced packaging and semiconductor processing .
  • Mentor and guide junior engineers, fostering a culture of continuous learning and innovation .
Required Qualifications:
  • Bachelor's or Master's in Electrical Engineering, Computer Engineering, or a related field.
  • 10+ years of experience in semiconductor electronics & ASIC design .
  • Expertise in mixed-signal and chiplet design .
  • Strong knowledge of BEOL & FEOL semiconductor processing .
  • Experience in advanced packaging technologies & high-speed chiplet I/O .
  • Proven ability to ensure signal & power integrity in complex designs.
  • Strong collaboration skills to work with cross-functional teams .
Preferred Qualifications:
  • Ph.D. in a relevant field.
  • Experience with industry-standard design & simulation tools .
  • Published works or patents in semiconductor technologies .
  • Strong leadership, communication, and project management skills.

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